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Voidage Detection Technology In X-ray Images Based On AuSn Eutectic Welding Of Microwave Chips

Posted on:2022-05-04Degree:MasterType:Thesis
Country:ChinaCandidate:Q Q ChenFull Text:PDF
GTID:2518306557971189Subject:Electronics and Communications Engineering
Abstract/Summary:PDF Full Text Request
AuSn eutectic sintering technology is one of the processes most widely used in micro-wave chip assembly.Due to the limitation of the technology and the unsatisfactory assembly environment,sintered cavities are liable to appear when micro-wave chips are assembled on Mo Cu carriers.A large area of sintered cavity will make a bad influence on the heat dissipation of micro-wave chips,which will affect the performance of chips,and even burn them.Therefore,it is important to detect voids in eutectic sintering.At present,X-ray imaging is often used to identify sintered cavities,and then judge the quality of sintering micro-wave chips by manual inspection.X-ray imaging is distinguished by low gray level and low contrast,which makes it difficult to judge manually.In view of this problem,this paper,using digital image processing technology,provides a method for automatically identifying sintered cavities in order to make the extraction process of sintered cavities more objective and more efficient.The main research work is as follows:(1)The automatic detection system of sintered cavities in X-ray images;(2)Gamma correction preprocessing;(3)Improved OTSU segmentation based on morphology;(4)The optimal selection of structural elements of corrosion expansion gradient operator.Finally,the complete process of extracting sinterd cavities was determined by experiments.Filtering preprocessing,contrast enhancement,morphological method to extract image edges,filling the sintered cavities,OTSU method to segment the image,morphological method to pruning the image and other steps successfully extracted and marked sintered cavities,and the effectiveness of this idea and the robustness of the algorithm are verified.
Keywords/Search Tags:AuSn Eutectic, Microwave Chips, X-ray Inspection, Defect Marking, Morphological Techniques, Robustness
PDF Full Text Request
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