| Inner circle slicing technology is one of the mainstream technologies in the field of silicon wafer processing.Domestic inner circular slices are produced mainly by single machine cooperating with workers' manual feeding and unloading,it's low level of automation is increasingly unable to meet the rapidly growing demand for silicon wafers in today's industry.Based on the current situation of the production of inner circle slices,the research was carried out as follows aims at improving the automation level of the production of inner circle slices.(1)In view of the low level of automation in the production of inner circle slices,a new production mode of inner circle slices was designed:The automation transformation was carried out on the original inner circle slicing machine.then the reformed inner circle slicing unit was connected into a assembling unit to produce cooperate with the automatic feeding and unloading manipulator system designed for it.(2)The work of the whole manipulator system was clearly defined,the coordinate form of the manipulator was determined according to the functional requirements of the manipulator system,and the transmission schemes of the axes of the manipulator were designed.The mechanical structures of the axes were designed according to the determined transmission schemes.Finally,the overall structure design of the whole manipulator system was completed by Integrate the structure of each axis.(3)The control program of the manipulator system was designed with PLC as the control core,and the upper computer interface program is compiled with MFC under VS2015 environment.Through subsequent debugging and improvement,the automatic control of the manipulator system was finally realized.The new production form of inner circle slice and the designed automatic feeding and unloading manipulator system can greatly improve the automation level of inner circle slice production,and the research results have good practical application prospects. |
PDF Full Text Request