Study On The Response Characteristics Of Non-Linear Material For LTCC Thermal Shock Test

In recent years,the rapid development of information technology,the continuous innovation of communication technology,the continuous promotion of microelectronics technology have made great progress in the applications of aerospace,radar antenna and civil communication.It has become one of the important pillars of national defense construction,the foundation of modern industry and the development of national economy.With the development of mobile communication towards high reliability and small size,higher requirements for microelectronic technology are put forward.Microelectronics technology depends on substrate technology and sealing and packaging technology,and substrate technology is at the core and core.LTCC(Low Temperature Co-fired Ceramics)technology plays an important role in the microelectronic system.LTCC technology can meet the requirements of microelectronic components with small size,high reliability,high integration and low price in the process of microelectronic development.Moreover,the slurry composition of LTCC can be adjusted,and its coefficient of thermal expansion and thermal conductivity can be changed by selecting the appropriate proportion and components.In the process of the development of LTCC,many experts and scholars have produced a variety of LTCC materials with different coefficient of thermal expansion and thermal conductivity by studying the distribution ratio of different ceramic materials.The influence of temperature on the thermal properties of LTCC materials has also been extensively studied in the process of sintering.The research object of this paper is a LTCC substrate determined by the material component,whose temperature load is working environment temperature(-55 °C~125 °C),that is,the crack failure phenomenon of the LTCC substrate during the thermal shock test under the working condition temperature is analyzed.The response characteristics of the thermal stress of the LTCC substrate with the temperature change under the nonlinear condition of the material are studied.The main contentrates drawn from the study can be summarized as follows:(1)The relationship between the thermal stress of a LTCC material and the temperature variation under a single factor of elastic modulus with temperature variation in consideration of the material properties is analyzed.The relationship between the thermal stress of the LTCC material and the temperature variation with the single condition of the temperature variation is analyzed.On this basis,the effect of the modulus of elasticity and the coefficient of thermal expansion with the temperature change is considered,and the thermal stress of the LTCC material is analyzed.The response characteristic with the change of temperature.(2)The finite element model of temperature field solution is established,and Matlab software is used to program the thermal stress of LTCC substrate to change with the temperature.Compared with the simulation analysis results of the finite element software ANSYS,it is proved that the response of the thermal stress to the temperature variation under the material nonlinearity is reasonable.(3)On the basis of the above research,a finite element model of a LTCC substrate is established,and the thermal structure analysis is carried out.The thermal stress distribution cloud of the LTCC substrate is obtained.And compared with the known failure position distribution map of the LTCC substrate,the failure reason of the LTCC substrate is analyzed,which provides support and guidance for the design and optimization of the LTCC substrate in the future.