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Research On Key Technology Of Reconfigurable Radio Frequency Microsystem

Posted on:2022-10-17Degree:MasterType:Thesis
Country:ChinaCandidate:Y Y WuFull Text:PDF
GTID:2518306524485964Subject:Master of Engineering
Abstract/Summary:PDF Full Text Request
T/R plays a key role in modern electronic warfare,information warfare,multi-stage wireless communication and the global positioning system.T/R module is the key part of the multi-beam phase field radar.There are many T/R modules in a multibeam Phase ray.It is of great importance to study the miniaturization and high integration of the T/R module in order to In the phased array radar uses many control modules for signal switching and frequency selection,so that it is very important to reduce the size of the control module.This paper presents the method of multi-beam production in phase field radar before.This paper designs a 2-18 GHz of 4 switching matrix based on HTCC.The Soft matrix RF substrate consists of 33 layers of HTCC substrate,and its size is only 33mm×35mm×3.15 mm.As input signals are four completely independent RF signals with four output channels every one output channel can arbitrarily one of the four input signals of the RF activate.Several common horizontal interconnection structures,vertical interconnection structures and interconnection structures are examined on board.For the switching matrix,the input/output transition with SSMP connectors,the switching transition between switching chips are examined.the 16-channel-stripline horizontal connectivity transition and the 16-channel-sub-channel vertical connectivity transition designed.Arduino MCU is used to control 24-switch signals simultaneously,what the test time is significant reduced.In addition,a 21-23 GHz T/R module is developed on the basis of a fanout package,packed by fanout process The 4-Channel-Transceiver-Link has the Fanctions of phase shift,damping and amplification,and its total size is only 5.68mm×6.4mm×0.22 mm.for T/R-module,the system transition at the level of the BGA and the internal transition of the chip connection structure are based on the Fanout process designed.Arduino MCU is used as a core control unit to control the phase shift and damping of the T/R module.The results appear to be less than 20 dB in S1 and S22 2-10 GHz francs band.And the loss of less than 10 dB and communication from S11 and S22 is a sub-channel of10-18 degrees french banquet matrix.Solidarity from less than 50 dB.Moreover,failure to deny is less than 3dB,failure to change fase is less than 15° and the gain error is less than 1dB.The transdriver's state testing shows that refusal error is less than 5dB,fax change error less than 15°.
Keywords/Search Tags:T/R components, switch matrix, high temperature co-fired ceramics, fanout package
PDF Full Text Request
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