Experimental Study On Selective Laser Plating And Etching Process Of PCB Circuit

With the rapid development of computer,automation,and electronic science and technology,PCB is also becoming more and more integrated,refined,and miniaturized.At the same time,the output of PCB continues to grow rapidly,and the variety and categories of PCB continue to increase.The production cycle is continuously shortened.In particular,with the rapid growth of intelligent robots and automatic control systems and the rapid development of various types of electronic instruments and components,new demands have arisen for the rapid production and flexible manufacturing of PCB.With the development of laser technology with semiconductors,computers,and nuclear energy,which are also known as the four great inventions of the 20th century,the application of laser technology in PCB production is becoming more and more widespread,and more and more categories are being applied.Laser technology has become a PCB builder,which received public attention.In this paper,laser selective etching experimental study on PCB preparation subtractive technique and laser application technology is carried out.The surface of the copper clad laminate was surface-treated with the coating and surface blackening to increase the absorption rate of the laser,and the laser etching effect of the clad laminate treated with different blackened coating materials was compared to find the blackening treatment most suitable for the surface of the clad laminate.The coating material is a photo solder resist.The UV-visible near-infrared spectroscopy of copper-clad laminates coated with different color photo-resistors was observed.The variation of absorptivity with wavelength was observed.Different color-selective photo-resistors were selected for different wavelength lasers.The analysis results show that the blue photo-resist solder is best suited as a surface blackening coating at a wavelength of 1064 nm.The black oxidation of the surface of the copper clad laminate can also be increased by using a mixture of NaClO₂ and NaOH,and the absorption rate of the laser can be increased.The optimum black oxidation formula and process can be optimized through orthogonal experiments,and the black oxide film prepared through the best process can be processed.SEM,XRD analysis and laser etching verification experiments show that the black oxidation process can effectively improve the laser absorption rate of the PCB substrate copper foil and improve the etching quality of the PCB.In this paper,experimental studies on laser selective electroless plating for PCB preparative addition and laser application techniques were conducted.The glass fiber epoxy substrate coated with ACD/BCD colloid was irradiated with laser at a wavelength of 445 nm,and the silver nanoparticles were reduced and embedded in the substrate as an activation center for catalytic electroless copper plating to investigate the laser parameters on the lithography morphology and the morphology of the copper plating layer.The morphology and particle size of the nanosilver were investigated by SEM and AFM.The composition of the lithographic region was analyzed by XRD.The results showed that there existed Ag in the lithography region and the distribution of Ag after lithography was analyzed by EDS.Finally,a comprehensive test analysis of the copper plating line for roughness,bonding force,and conductivity was performed.Based on a large number of experiments,the experiment of laser plating activation liquid,photosensitive film preparation process and developing process were optimized by orthogonal experiments.The results show that copper wires with strong bonding and good conductivity were successfully prepared.