Preparation And Control Technology Of Piezoelectric Actuator

With the development of technologies such as electronics,machinery,information,and communications,people can already look forward to the specific application scenarios of various types of miniature sensors,actuators,and wireless transmitters in the Internet of Things(loT)society in the future.Among them,the actuators,as an important execution device,is processed by MEMS(MicroElectro-Mechanical-Electro-Mechanical-System)technology,and has the advantages of high processing precision,small size,and low cost in batches.In this paper,a cantilever beam micro-actuator is fabricated from bulk PZT piezoelectric material with a thickness of 300 ?m.The cutting process,bonding process,thinning process,and laser ablation process and wet etching of silicon are selected according to the selected material.The etching process combination completes the preparation of the cantilever beam.The simplified analysis of piezoelectric cantilever beam model and ANSYS modeling simulation were carried out.The theoretical calculation values and simulation values of cantilever beam tip displacement were given.During the process discussion and preparation,the preparation methods of piezoelectric layers with different thicknesses were introduced.The characteristics of piezoelectric films with different thicknesses were compared and the selection of bulk PZT was combined with eutectic bonding process to reduce the thickness.A piezoelectric thick film is prepared.In the bonding process,Au was used as an intermediate layer,and the influence of Au thickness on the bonding strength was discussed,and the total thickness of the Au layer was determined to be 1.8 ?m.The alignment of the cantilever beam and the release of the structure are accomplished by reserving the cutting groove and using laser ablation processing techniques.After the preparation,the test system was set up to complete the test of the output displacement-voltage curve.The data curve of the static and load state reflected the inherent hysteresis characteristics of the piezoelectric ceramic.After discussing the causes of the hysteresis characteristics,a feedforward compensation control model with PID or fuzzy PID based on the inverse hysteresis model was used to compensate for the displacement output of the driver.The Simulink simulation was performed on the control model.And compared the tracking error,overshoot,and dynamic response performance of the two algorithms.