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Study On The Key Technology Of Optical Coupling And Testing For Silicon Photonics Chip

Posted on:2017-09-15Degree:MasterType:Thesis
Country:ChinaCandidate:G B ZhangFull Text:PDF
GTID:2428330482480965Subject:Physical Electronics
Abstract/Summary:PDF Full Text Request
With the rapid development of the optical fiber communication technology,the interconnection from the inter-chip connectivity to the large-scale data exchange between data center processing,are urgent demand for high-speed,reliable,low cost and low power consumption.So far,the mainstream optical interconnection technology is divided into two categories.One is based on the III-V semiconductor materials,the other is based on silicon,with the existing mature Complementary Metal-Oxide-Semiconductor Transistor(CMOS)process compatible materials.Optical interconnection technology based on III-V semiconductor material has good optical performance,but its high cost,complex process,difficult process,and low integrated degree limit the large-scale optoelectronic integrated development in the future.However,the silicon waveguide device can provide a solution for the high speed optical interconnectio n with great potential by combining the photon function with the smart electron.At present,the waveguide modulator based on SOI has been widely studied,a lot of progresses have achieved.But in the process of industrialization,a series of problems are faced.Among them,the effective coupling between waveguide chip and fiber is a big problem.In this paper,we proposed and numerical simulated a inverted cone type coupling structure which is based on a model of the cantilever type coupling structure.By developing corresponding effective coupling technology to implement the coupling experiment,we verified the good structure of the coupling efficiency.On the basis of the inverted cone type coupling structure,the silicon waveguide modulator is coupled,and the performance of the packagedmodulator is tested.In this thesis,we mainly study the coupling packaging and testing technology of silicon modulator chip based on silicon waveguide modulation technology.The main work can be divided into four parts.(1)Based on the theory of waveguide,the waveguide mode characteristics of the strip waveguide and the ridge waveguide and the light field confined characteristics of silicon waveguide are analyzed.(2)In the coupling process of the cantilever type coupling struc ture,the influence of the size of the coupling structure on the insertion loss,the coupling tolerance are analyzed.The coupling structure is optimized and the effective coupling process is developed.(3)The carrier dispersion effect of silicon waveguide modulator and the basic structure of Mach Zehnder Interferometer(MZI)are analyzed and optical modulator is introduced and analyzed from both optical structure and electrical structure.(4)The waveguide modulator is coupled and tested by using the developed coupled packaging technology.Based on the analysis of the modulation characteristics of the MZI waveguide modulator,a mathematical model is established,and the fast test method of the DC bias voltage of the modulator is summarized from the viewpoint of mathematics.By eye diagram analysis of the problems existing in the modulator,we provide the improvement direction for subsequent research.
Keywords/Search Tags:Waveguide Theory, Inverse Taper, Coupling Efficiency, PDM-QPSK, IQ Modulator
PDF Full Text Request
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