Research On Optimization Of Heat Transfer Characteristics Of Power Module Cold Plate

With the development of electronic equipment in the direction of modularization,integration and miniaturization,all kinds of power modules(IPM)with strong functions,good performance and small size have been widely used,but they have brought problems such as high energy consumption and high heat flow density.Therefore,in the process of application,whether the heat production of power modules can be effectively eliminated,it has become a key problem and restricting their performance.Aiming at the heat dissipation of power module,this paper puts forward two kinds of heat dissipation modes:flat heat pipe air cooling and water-cooled plate heat dissipation,and studies the heat dissipation performance of these two kinds of heat sinks by means of experiment and numerical simulation,which provides theoretical support for the optimization design of heat dissipation system of power module.In this paper,models of heat pipe air-cooled and water-cooled radiators are constructed from the aspects of module layout,flow structure,plate length and flow channel structure.The radiators under different working conditions such as different fluid flow rates,module power,inlet and outlet pressure drops are analyzed.The influence law of thermal performance.The factors influencing the efficiency of the cooling performance of the four cold plate channels under the flow rate of 2m/s and the module power of 100W,the Fang shape,Changfang shape,Lv shape,and Tian shape are analyzed respectively.The results show that the integrated cooling with the power module The heat dissipation mechanism of the board structure module(Fang shape,Changfang shape)is better than the split strueture(Lv shape,Tian shape).When the square module is used,the heat dissipation of the flow channel structure is:S-type>Chang-type>Gong-type>Ri-type,and the inlet and outlet pressure drop of the S-shaped channel is the largest.It is also found that both the heat dissipation and flow resistance of the sheet structure are better than that of the column structure.Although the heat dissipation of the double sheet structure is better than that of the single sheet structure,the flow resistance of the single sheet structure is less than that of the double sheet structure,which needs to be considered comprehensively.Increasing the plate length can improve the cooling efficiency of the cold plate,but it will increase the flow resistance and affect the linear increase of the cooling efficiency,which needs to be considered comprehensively.At last,the application of dual module in the cold plate is studied.It is found that the maximum temperature difference between single and dual module decreases with the increase of fluid velocity in different power states.The transformation proves that when the cold plate is applied to the dual module structure,it has higher heat dissipation efficiency.Finally,the simulation results are verified by experiments.Through experiments,the thermal performance and thermal resistance variation rules of cold plates with different structures are obtained.Finally,a new type of flat heat pipe is simulated and experimentally studied.It is found that it can maintain good thermal diffusivity at high power,effectively avoid the thermal stress concentration of the power module,and provide guidance for solving the heat dissipation problem of integrated electronic devices.