Research On The Performance Of SiC Power Module Double Sided Microchannel-micro-pinfin Radiator

With the rapid development of power electronics technology,SiC power modules have attracted the attention of major chip manufacturers due to their higher switching frequency and lower turn-on voltage.As the core component of new energy electric vehicles,while improving the efficiency of new energy electric vehicle inverters,the power density of SiC chips also increases,resulting in a sharp increase in chip heat flux.The heat dissipation requirements for SiC power modules are also increasing.come higher.Therefore,based on microchannel heat exchange technology,this article studies the heat dissipation effect of composite microchannels on SiC power modules based on microchannel heat transfer technology.The specific contents are as follows:（1）The experimental system of a constant flow microchannel heat exchanger was built,and convective heat transfer experiments were carried out to study the influence of the fluid working medium on the flow and heat transfer performance of the microchannel heat exchanger at different flow velocities.The results show that as the flow rate increases The R_th and f showed a downward trend,decreasing by 7.3%and 33.3%respectively,and the Nu,convective heat transfer coefficient,andΔP increased by multiples.（2）The experimental data were used to verify the mathematical model used,the relative error was calculated,and the error was less than 15.0%,proving that the model used was feasible.The results showed that theΔP and f of the square micro-rib composite microchannel are the largest,and the triangular micro-rib structure is the smallest,which are reduced by 33.1%and 49.4%,respectively.When Re=150,the convective heat transfer coefficients of triangular micro-pin-fin composite microchannels increased by15.5%and 15.0%,respectively,compared with those of square and boot-shaped micro-pin-fin composite microchannels,and the relative Nu of triangular micro-pin-fin composite microchannels was the largest,and the comprehensive heat transfer performance was the best.（3）For the structure of triangular micro-pinfin composite micro-channel radiator,the influence of different hydraulic diameters on the flow and heat transfer performance of the radiator was studied.The results showed that at the same Reynolds number,the pressure drop of the channel with D_h of 1.3 mm was smaller and the heat transfer performance was the best.Excellent,the channels with D_h of 1 mm and 1.3 mm have the same convective heat transfer capacity.Subsequently,the heat transfer performance of microchannels of brass,oxygen-free copper,silicon and aluminum materials was compared.The results showed that T_max of oxygen-free copper decreased by 41.7%,20.8%and 35.8%respectively compared with brass,silicon and aluminum materials,and R_th Compared with brass,silicon and aluminum materials,the maximum decrease is 60.9%,36.4%and54.9%,respectively,and the microchannel made of oxygen-free copper has better heat transfer performance.（4）The influence of the composite microchannel and the rectangular microchannel on the junction temperature of the SiC power module chip was compared and studied.The research shows that when the power is 240 W,the thermal resistance of the composite microchannel is about 17.5%lower than that of the rectangular microchannel.When Re=150,the chip junction temperature of the composite microchannel is 20.23°C lower than that of the rectangular microchannel,which has better heat dissipation capability for the chip.And the composite microchannel has better temperature uniformity.（5）The single-sided and double-sided composite microchannel structures of SiC chips were studied when the power was 240 W,288 W,and 336 W,respectively,and the law of chip junction temperature under different flow directions was studied.The results show that:at different power levels,the junction temperature of the single-sided composite microchannel and double-sided composite microchannel chip decreases by about 30.7%,31.6%,and 32.3%,respectively,and the thermal resistance of the designed double-sided composite microchannel is 37.2%lower than that of the single-sided,The double-sided micro-channel structure has better heat dissipation performance.The junction temperature of the SiC chip is basically the same under the condition of forward flow and reverse flow.