Research On Microchannel Heat Dissipation Technology Based On Embedded Heat Dissipation Module

The development of artificial intelligence and fifth-generation mobile communication technology is driving the rapid development of electronic chips towards miniaturization and high integration,but it also results in increasingly severe heat dissipation problems of electronic chips.In practical engineering applications,chip arrays often work simultaneously,so in addition to considering the heat dissipation performance and temperature uniformity of individual heat sources,the temperature uniformity between heat sources is also an important issue.Therefore,there is a need to propose a heat dissipation technology that can effectively improve heat dissipation capacity,temperature uniformity,and is suitable for multi-heat source heat dissipation problems.According to the project requirements,the author proposes a microchannel heat dissipation technology based on embedded heat dissipation modules,which integrates three types of enhanced heat transfer paths,and conducts several research studies:Ⅰ.The flow and temperature fields of three microchannels with embedded heat dissipation modules and a straight rectangular microchannel are compared and analyzed using numerical simulation.The performance improvement of the three microchannels with embedded heat dissipation modules relative to MC-SR is also analyzed.As a result,the microchannel with embedded module with rib and pin-fin(MC-RPF)is selected as the core heat dissipation structure,and the four critical structural parameters of MC-RPF are studied and analyzed.The outcomes demonstrate that compared to other heat dissipation structures considered in this study,MC-RPF can increase heat transfer performance by 41.02% and temperature uniformity by 59.6% while increasing pressure drop by 26.71%.Ⅱ.Based on the first study,the four parameters of MC-RPF,i.e.,rib height,pin-fin height,pin-fin number,and auxiliary channel number,are optimized using response surface analysis and a fast non-dominated sorting genetic algorithm(NSGA-II)with pressure drop,thermal resistance,and temperature standard deviation as objectives.The TOPSIS algorithm is used for multi-dimensional decision-making to obtain the structural parameters of MC-RPF with the best comprehensive performance.The optimized MC-RPF is then compared with the structure in response surface planning using numerical simulation,and the results show that the comprehensive performance of the optimized MC-RPF is improved by 3.04% to 124.31%,compared to the non-optimized one.Ⅲ.A modular heat dissipation idea was used to propose a multi-heat source heat dissipation structure based on MC-RPF.Structural design analysis and pressure drop optimization were performed,and this structure uses MC-RPF to dissipate heat specifically for each heat source.Numerical simulation was used to conduct a comprehensive analysis of the heat dissipation performance,temperature uniformity,and flow performance of three MC-RPF interconnected channels(series,parallel,and hybrid MC-RPF channels)from several perspectives,including multiple field distributions,heat transfer performance between heat sources,and overall performance.The TOPSIS algorithm was used to comprehensively evaluate the three MC-RPF interconnected channels.The results indicate that the three MC-RPF interconnected channels are suitable for multi-heat source heat dissipation problems in different flow rate ranges.Due to the hybrid MC-RPF channel having the widest flow rate range and good performance in other flow rate ranges,it is selected as the MC-RPF interconnected channel for the multi-heat source heat dissipation structure.Finally,the hybrid MC-RPF was optimized for pressure loss based on the relevant pressure loss theory,reducing pressure drops by 36.73%.