Research On Structural Design And Thermal Design Optimization Of Submarine Equipment

Through the structural design and thermal design practice of a potential sealed electronic cabinet,the detailed contents of the cabinet chassis and the heat dissipation structure design are elaborated in detail.The structural design,shape design and thermal design optimization scheme of the enclosed cabinet are studied in depth.First of all,this paper uses engineering materials,tolerances,materials mechanics and mechanical parts and other related knowledge,according to the electrical schematics and components of the weight,thermal power dissipation and other components distribution location,and design the chassis structure,the necessary stress calculations.According to the simulation results,the local position adjustment and modular design of components with long traces and large heat are performed,and the structural layout optimization design of the device is performed from the perspective of improving maintainability.Secondly,this paper applies the knowledge of fluid mechanics,heat transfer and finite element analysis to study the practical application of finite volume method in the field of structural design of electronic equipment and thermal design of electronic equipment.The finite volume method is used to solve temperature integral control equations.The establishment,linearization,and calculation process;analyzed the structural characteristics and boundary conditions of the research object,simplified the whole model;analyzed the heat source of the whole machine through heat transfer theory,defined various parameters and boundary conditions,and analyzed the simulation results;The local overheat heat source improves the overall air duct circulation inside the chassis by using custom diversion channels,fans to increase the flow in parallel,optimize fan cooling fins,and adjust printed board ventilation gaps.This optimizes the overheated components to a reasonable operating temperature range.The thermal simulation software was used to optimize the structure of the liquid cooled cold plate.The temperature rise of each heat transfer stage of the liquid cooled cold plate inside the system was calculated using numerical heat transfer and computer fluid dynamics to meet the pressure drop of the flow channel and the chip.Designing different reasonable flow channel structures on the premise of temperature control and using numerical simulation Select the best structure.Combined with thermal analysis software FLoEFD,the different heat dissipation structures of the whole machine were simulated and analyzed,the optimal cooling design improvement program was determined,and the engineering prototype was tested.The thermal design optimization results are compared with the actual thermal measurement data to make an error analysis,thereby more effectively demonstrating the reliability of the optimal thermal solution.