Research On Cutting Technology And Tooling Of Diamond Outer Circular Saw

Sawing natural diamond can obtain diamond cutting surface with good surface quality,so it is still widely used.However,the cutting quality is largely affected by the cutting process,and today’s sawing process is not complete,and the impact of related sawing mechanisms and sawing factors on the surface quality of the cutting surface is not clear enough.And the diamond surface after sawing often has some defects,which seriously affects the surface quality of the diamond cutting surface.At present,the research on diamond cutting mainly focuses on the impact of cutting methods and different processing methods on the surface quality of the cutting surface,but the research on the impact of the cutting process on the surface quality and the suppression of cutting surface defects is relatively small.Therefore,the research on the sawing process,the cause of the defect surface and the suppression method is particularly important for the development of the diamond industry.This paper first analyzes the removal mechanism of natural diamond materials,supplements and expands the sawing process according to the material removal mechanism,and deeply studies the impact of the sawing process on the surface quality of the diamond cutting surface.Subsequently,combining the material removal mechanism and process research,a variable-parameter sawing experiment was performed on the octahedron diamond to obtain a diamond cutting surface with surface defects.The relevant equipment was used to inspect the diamond cutting surface,and the roughness of the cutting surface was obtained.It was learned that part of the diamond on the diamond cutting surface was transformed into carbon allotrope,and the types of defects,that is,knife marks and chipping angle.In view of the different defects of the diamond cutting surface,the cause of the diamond cutting surface has been studied from two aspects: sawing process and cutting device.The results show that in addition to the sawing process,the structural problems of the cutting device itself are also the main cause of the defects.Based on the results of sawing process and tooling research,the cutting device was redesigned.Finally,the designed cutting device was used to cut the diamond to obtain a natural diamond cutting surface.After testing the cutting surface with corresponding testing equipment,it was found that the roughness of the diamond cutting surface has been improved to a certain extent,and the allotrope content of carbon generated on the cutting surface has been reduced under the same sawing parameters.Under the corresponding sawing parameters,defects such as knife marks and chipping angles have been effectively suppressed,and knife mark and chipping angles will hardly appear again,and the surface quality is very good.The relevant test results also prove the correctness of process analysis and tooling research.