High Density Transmission And Control Technology Of Microwave Signal Based On Multilayer

The miniaturization,integration and lightweight demands of microwave circuits have made the 3D layout and assembling technology of microwave circuits more and more important and widely applied.In a variety of three-dimensional layouts of microwave technology,microwave multilayer printed technology based on mature PCB technique,has reliable environment adaptability,excellent RF interface integration capabilities,large size processing capacity,and in general the EDA platform to carry on the design is very competitive in realizing the microwave high reliability and miniaturization system.This paper mainly studies the high density transmission and control technology of microwave signal on multilayer.Firstly,the basic theory of transmission line and electromagnetic compatibility on microwave multilayer circuit is introduced.Bucause the existence of prepregs,buried transmission line of microwave multilayer in inhomogeneous medium,compared with the tranditional stripline have bigger difference,and the corresponding parameters cannot use closed form to illustrate.Therefore,commercial full-wave electromagnetic simulation softwave HFSS should be used.Buried transmission lines of the different laminated structures are simulated and analysed using HFSS.obtained the suitable embedded type for the engineering application,a transmission line and its parameters are analyzed and studied.The electromagnetic environment inside microwave mulitilayer is very complex,so the EMC design for the microwave multilayer has the effect for the whole microwave circuit even the system cannot be ignored.Therefore,electromagnetic compatibility theory and technology are used to analyze the typical interference sources and coupling channels in microwave multilayer circuits,and the measures to improve electromagnetic compatibility are obtained.Whereafter,the typical embedded discontinuous structure in the microwave multilayer is studied,and the best oblique cutting and phase shift characteristics of the embedded straight bending Angle on type ? laminated are analyzed.The mathematical modeling and performance optimization of the embedded asymmetric direct bending Angle and impedance step are carried out,and the RF vertical interconnection structure is simulated and optimized to obtain good RF performance.Then the embedded components in microwave multilayer printed circuit are studied.The implementation approach and simulation performance of buried resistance,load and capacitance are discussed respectively.the tolerance analysis of buried resistance was carried out.The buried power splitter was studied based on buried resistance technology on microwave multilayer.the power splitter that covers whole L band is designed by using the embedded resistance technology.the power splitter was modeled,simulated and optimizated on structure and dimension,and obtained good RF performance.Finally,using microwave singnal transmission and control technology of multilayer,the L band 4×4 switch matrix was designed and implemented on PCB of 120mm×70mm×20mm size,and test was carried on,which demonstrates a good RF performance.