Electromagnetic Properties Of The Vertical Through-hole Structure Of The Multilayer Microwave Circuit Analysis

With developing of microwave integrated circuits, the technology of plane circuit reaches the limit. In order to reduce the size of circuit, a realistic approach is to develop the three-dimensional space technology. The current popular multi-layer microwave circuit is one of the most important applications in the three-dimensional space technology. The same as other familiar multi-layer circuit, multilayered microwave circuit is actually a folded structure of plane microwave circuit. Between the layers, it uses the metallic via to propagate the microwave or DC signal in vertical direction. However, with the working frequency reach the microwave band, the discontinuity of via causes serious reflection and radiation in high-frequency. The simple via connection has been difficult to achieve high-quality signal transmission. In this paper, we establish an effective model to analyze the electromagnetic properties of the connecting structure of via in multilayered microwave circuit.Through microwave network decomposition principle, we divided multilayered microwave circuit into simple circuit of sub-structure to analyze. In the analytic process, as to the special structure, we use different models to analyze the structure. According to the comparison with simulation results of business simulation software HFSS,we can verify the accuracy of the results. And through effective simulation of the relevant geometric parameters, we obtain some meaningful conclusions in the process of designing the connecting structure of via in multilayered microwave circuit. Also provide strong theoretical support for the engineering design.