LED's Chip On Board Packaging Technology With Micro Small Size For Lighting And Communication

LED packaging technology is an important factor to promote the development of LED.Itegrated package with high density and high light is currently the mainstream LED package.The light source module based on COB has the advantages of high power,high efficiency and wide application range.The COB package determines the photoelectric parameters,chromaticity parameters and modulation performance of the light source which meets the high bandwidth requirements of visible light communication technology.Therefore,the quality of LED packaging determines whether the LED visible light source has superior performance.This technology enables LED to take into account the areas of lighting and communication.In this paper,the optical model of COB integrated package is established to simulate the change of the light source by the change of fluorescent glue.The COB standard light source module is designed and manufactured with the optimization of COB packaging technology.We put forward a method to precisely control the color tolerance of white light source within1 step by optimizing the ratio of phosphors.And The consistency of color tolerance obtained by this method is better than international mainstream products.The test results show that the average efficiency of the standard LED light source module with COB is up to 150lm/W.Then a special micro size array chip has been designed to meet the requirements of LED modulation frequency and response time for visible light communication,and we design the packaging structure and the substrate.COB packaging is adopted to package micro array chips and apply the color tolerance control method mentioned above to this experiment.The luminous efficiency of the sample is up to 138 lm / W @ 20 mA.The bandwidth test shows that the bandwidth can reach 100 MHz when the current is 60 mA.Compared with traditional LED lighting which is only 3MHz in the same current range,the results show that the micro array chip packaging structure can effectively improve the chip modulation frequency and realize the function of lighting and communication sharing.