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Keyword [ANSYS Icepak]
Result: 1 - 3 | Page: 1 of 1
1.
Study On The Sealed Electronic Equipments Structural And Thermal Design
2.
Research Of The Techniques Of Sensor's TEC Cooling Package
3.
Modeling And Simulation Of Plate-level Reflow Soldering Based On Ansys Icepak
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