Study On Damage Mechanism Of Polysilicon Irradiated By High Repetition Frequency Picosecond Pulse Laser

In recent years,the study of the interaction between laser and semiconductor materials is one of the most important research fields.The ablation threshold is reduced by irradiation with a series of laser pulses,which might be useful in application of the high-repetition-rate lasers with the low pulse energy in order to increase the processing efficiency.Therefore,it is very significant to obtain damage mechanism and characteristic of polysilicon materials in multi-pulsed laser irradiation.In this thesis,the damaged mechanism of polysilicon materials is systematically studied by high repetition frequency picosecond pulse laser.Firstly,basic characteristics of polysilicon are analyzed.Secondly,the laser damage experimental system is established,the damage threshold at different irradiation time is measured.The damage law of polysilicon irradiated by multiple repetition frequency laser is studied.The difference of damage characteristics under different wavelengths is obtained.Finally,the damage characteristics,damage law of polysilicon material under high repetition frequency picosecond pulse laser irradiation are analyzed.The study results lay the foundation of the processing technology,such as cladding,cutting and coloring about polysilicon material under high frequency picosecond pulse laser.