Device Development And Experimental Research Of Multi-wire Saw Assisted With Vibration

With the large-scale integrated circuits and solar cell industry,the rapid development of silicon demand tends to large diameter,the surface quality requirements are also increasing,and its processing difficulty also will be increased,the wafer cutting is to determine the production of silicon Quality of the key links.Multi-wire saw is the mainstream of wafer cutting equipment,but because of the complexity of processing technology,processing of silicon prone to warping,collapse and other phenomena and processing quality and processing efficiency to be further enhanced.Therefore,the need for new vibration-assisted technology for multi-line cutting,to further improve the cutting efficiency and improve the surface quality.The vibrating action is applied to the free abrasive multi-line cutting,which can change the movement trajectory of the abrasive,optimize the cutting path,and make the abrasive produce agglomeration effect.The number of the abrasives involved in effective cutting increases per unit time,which can effectively improve the cutting efficiency and the cutting surface quality.The application of high-frequency vibration in multi-wire sawing has been studied,and the application of mid-low frequency vibration is still being explored.Under this background,the hydraulic vibrating table for medium frequency vibration and eccentric Shaking table,and applied to the cutting experiment.The main work and achievements of this paper are as follows:(1)Explores the wire saw of free abrasive material removal theory,Based on the existing research,the rolling-indentation model was used to analyze the stress of single abrasive grain,and the mathematic model of single abrasive grain volume removal was established under the action of vibration.Through MATLAB simulation analysis,we get the processing efficiency growth rate image corresponding from 0 to 80000 Hz frequency range.(2)According to the multi-wire saw vibration-assisted experimental requirements,developed a hydraulic vibration and eccentric vibration table.ANSYS software is used to analyze the harmonic response of hydraulic vibrating cylinder and eccentric vibrating table respectively,and the rationality of shaking table design is preliminarily verified.(3)Through the experiment of laser displacement sensor,the displacement waveforms of the hydraulic shaking table and the eccentric vibration table are obtained,and the performance of the vibration table is tested.Using high speed camera to shoot cutting process with pulp width,and the vibration of the band width under normal condition with the width of the tape to make a comparative analysis,to explore the impact of vibration on the processing efficiency.It is concluded that the cutting efficiency and the value of the surface roughness are obtained by the experiment,the processing parameters such as the line speed and the feed rate.In this paper,The hydraulic vibrating table and eccentric vibrating table developed in this paper extend the applied frequency of multi-wire saw vibration to the middle and low frequency fields,which can effectively improve the processing efficiency and improve the surface quality,and provide effective theoretical support for future practical application.