Research On Preparation Technology And Device Application Of Paper-Based Printed Electronic Circuits

In recent years,with the development of low cost and flexibility of electronic products,the traditional printed circuit boards have been unable to meet the requirement of current electronic devices.Paper-based circuit is low cost,degradable.In the other hand,it can also be folded into three-dimensional devices.That is of great importance to the development of flexible printed circuit boards.This paper will discuss the preparation technology of paper-based conductive lines,and provide a feasible solution for the preparation of paper-based flexible printed circuit.This paper used jet printing catalytic ink and chemical deposition of metal layer to prepare conductive lines on paper surface.In order to solve the problem of solution-type catalytic ink's high permeability on high porosity paper,which leads to the slow process of electroless deposition and the discontinuous of deposited metal film.We used stannous chloride colloid solution,to form a layer of colloidal film on the surface of paper.That decreased the ink penetration depth from nearly 330 ?m to 100 ?m.So that the metal film could deposit into the paper-based fiber,enhance the adhesion of the metal layer.Besides,paper surface could retain enough catalytic ink to improve the quality of the deposited metal film.We optimized the time of electroless deposition process and improved the entire process.Without any harsh environmental requirements and sophisticated equipment,we fabricated a dense,smooth and continuous copper layer with enhanced conductivity of 70% of bulk copper.In addition,the accuracy of the prepared pattern reached about 95 ?m.With the study of the bending performance of the paper-based printed circuit,it is conclude that,whether it is folded or bended,paper-based flexible circuit could always maintain a certain degree of conductivity.Moreover,with the folding\bending performance of paper-based printed circuits,we also produced three-dimensional folding devices to show the potential application value of our process.Based on the design theory and the basic antenna structure,we designed a miniaturized UHF RFID antenna on 356 ?m thick Teslin paper substrate(the relative dielectric constant is 2.16 and the loss tangent is 0.0012),which conjugate matched with the NXP SL3S1002FTB1,115 UHF RFID chip.We used the developed process in this paper to prepare an antenna prototype.The actual measured S11 value at 915 MHz was-25 dB,the reading distance of the antenna was about 30 cm.The simple,environment-friendly and low cost of the developed process studied in this paper,combined with the flexible characteristics of paper substrate,could achieve large-scale production of RFID tag antenna with Roll-to-Roll process.That could maximize the marginal benefits of the scale,making the production cost of a single label reduced to a sub-level of the ultra-low price,to expand the scope of RFID technology applications.