SMT Solder Paste Printing Research About Fine Pitch Package

This paper mainly discusses part of electronic manufacturing process-SMT(Surface Mount Technology)fine pitch component solder paste printing,mainly related to 01005 chip component solder paste printing design method of element and solutions.The article simply introduces the development history of SMT.detailed the working principle,control points and features.It is to help readers to get clear overview of SMT process technology,to understand series of technology which involved here.First of all,Author study from the smallest package sizes chip component-01005 type.By bonding pad design,different pad surface treating methods to comprehensive research the impact of solder paste printing.At the same time,the author through the cross section,shear testing to confirm the final quality after reflow.Finally,Author's optimized design and OSP pad is recommended for fine pitch component solder paste printing.In this paper,another major influence of solder paste printing: stencil material is involved.Four types of different stencil were compared under the same conditions,the testing result proved the advantages of nano-coating stencil.Nano-coating stencil is recommended to SMT fine pitch in solder paste printing application.Last application technology research still focus on the stencil,the author initiate an advanced stencil aperture design rule,this scheme can guarantee with the same thickness of stencil,both of 01005 chip component or other larger ones' solder paste volume are meet requests.The new step-down stencil opening design rule can be directly used in SMT mixture size assembly process.