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Research On The Application Process Of Solder Paste Jet Printing And Online 3D Inspection Technology For Printed Boards

Posted on:2022-09-19Degree:MasterType:Thesis
Country:ChinaCandidate:S FengFull Text:PDF
GTID:2518306470458924Subject:Master of Engineering
Abstract/Summary:PDF Full Text Request
As a new type of solder paste coating technology without screen plate,solder paste spray printing technology can effectively improve the quality of solder joint in solder paste coating process,and reduce the occurrence of solder joint coating defects caused by the quality of screen plate.But at present,the research on solder paste spray printing technology is not perfect,and the application of solder paste spray printing technology in online detection production still needs further research.First of all,the problems encountered in the process of 3D solder paste detection and on-line detection of solder paste in the production line are studied by comparing the online detection parameters of solder paste with the online detection technology of the production line Data,through the mathematical analysis of the test data,the relationship between the key parameters of solder paste spray printing and the key parameters of solder paste detection is obtained,which provides theoretical support for reasonably predicting the appearance of spray printing solder joints and setting reliable spray printing and detection parameters.Secondly,the repeatability test,high and low temperature cycle test and vibration test are carried out to verify the optimized test results The quality of solder joint and the thickness of alloy layer can be observed by metallographic scanning to judge the rationality and feasibility of optimization parameters.Finally,taking PBGA packaging device as the object,the finite element analysis of solder joint before and after the optimization of solder paste spray printing parameters is carried out,and the change trend of equivalent stress and equivalent strain of solder joint in the process of temperature cycle is analyzed,and the value of equivalent stress and equivalent strain of solder joint at four different times in the process of temperature cycle are measured for comparison The reliability of solder joint is proved.The results show that the optimization of solder paste spray printing parameters and 3dspi detection parameters can effectively improve the first pass rate of solder joint and reduce the false alarm rate and false alarm rate of solder joint detection.It not only improves the solder joint quality and reliability,but also reduces the production cycle growth caused by false alarm and missing report,and realizes the intelligent on-line inspection production.
Keywords/Search Tags:solder paste spray printing, online detection, 3DSPI, reliability test, finite element analysis
PDF Full Text Request
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