| The key of the thesis is to establish the connection between 3D printing and electronic printing technique. Specific attention is paid to printing electronic circuits on flexible substrates. In order to explore the possibility of printing gradient materials, dual-color printing of fused deposition modeling is also discussed. The main points are summarized as:(1) Mono-layer electronic circuits on flexible has been printed by self-designed 3D printer. Experiment results show that the width and the thickness of printed circuits continuously increase as overwriting time increases while the resistivity keeps unchanged in a certain range. By comparing contact angles of four different substrates, such as PET(Polyethylene terephthalate), paper, rubber and PDMS(Polydimethylsiloxane), it is concluded that PET and paper are better adhesion materials for printing as their contact angles are smaller. Experiments of measuring the smallest width and the bending characteristics of circuits show that the performance of the printed circuits satisfies basic electric requirements.(2) A double-nozzle structure has been designed to print multi-layer electronic circuits, in which PLA is printed as the insulation layer between the upper and bottom circuits. Nozzles move in the square-wave path to prevent the needle scraping on PLA surface and some uneven factors. Insulation layer of superior characteristics between circuits is built.(3) Circuits have been successfully printed on a tilted surface which greatly reflects the advantage of 3D printing technology. The nozzle is able to move up and down during the printing and follow the tilted surface.(4) A dual-nozzle printing system has been built to print two types of materials or gradient models. It is demonstrated that the material-leakage problem can be solved through the following ways: change retraction amount and speed, use sharper nozzle with lower temperature at its outlet and increase the length of the outlet part with larger resistance. |
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