Microdisk Semiconductor Laser And Its Preparation Process

Semiconductor microdisk laser has the characteristics of simple geometry, small size, low threshold, high Q value and high degree of integration. It can be used as an ideal source for large scale photonic integrated circuits and ultra large scale optical communication systems.In this kind of microcavity, whispering gallery mode occupies the dominant position to ensure that the microdisk laser has a very high quality factor.Based on the analysis of WGM,we solve the shortcoming of the traditional circular symmetric microdisk cavity can not be directed out of the light by limacon cavity.After testing it has better beam quality and the directional emission at far-field divergence angle is about 36°.In addition,We studied the technological process of preparing microdisk laser,including photolithography, wet etching, ohmic contact and packaging technology. Optimizing the the fabrication process of the microdisk laser according to the existing experimental conditions.A smooth and less- defect cavity of the outer wall was prepared by dry etching and wet etching.Moreover,We use ANSYS15.0 to simulate the thermal distribution of the microdisk laser with different solder packages,and the results show that In is the suitable solder.Quantum cascade material preparation InGaAs/InAlAs microdisk lasers used in this paper, the optical power up to 7mW.