Etching Tie-bar Off Process Optimization And Research

Printed circuit board, as a provider of electrical connection for electronic components, has been widely developed and applied. However, gold finger printed circuit boards manufactured by traditional process, often fail when plug-in and pull out, and cannot get higher density. Through optimization of etching tie bar off process, company improved product quality, while avoiding the problem of bad electrical connections, got higher density circuits.By analyzing gold finger printed circuit board manufacturing process, including inner layer, brown oxidation, lamination, drilling, PTH, outer layer, surface finishing, routing, electrical test, final quality inspection, packing and shipping, especially compared the advantages and disadvantages between chamfered gold finger PCB process and etching tie bar off process, summed up 4 key elements affecting the etching tie bar off process and quality:under plating, poor alignment, copper speck and void. Through defect definition and failure tree analysis, using fractional factorial design of experiments, key factors to improve processes are identified: space between gold finger space, laminator type, dry film type, alignment type, PTH hole size and etc. Through process optimization and process capability analysis, process becomes stable, delivery time is shortened, and quality is improved.Company gets good result when putting the optimized etching tie-bar off process into mass production.