| Active phased array antenna(APAA) is integrated with a large number of T/R modules, and its packaging is based on multi-chip module technology, which uses micro welding and packaging process to assemble the components on the multilayer substrate of high-density to form a high density, high reliability, and high performance microelectronic products. In the high-speed interconnect systems, the multi-chip interconnecting technology in T/R modules is extremely important, and the structural errors caused by its own characteristics have a direct impact on the performance of T/R modules, restricts the realization of the whole radar system performance. Obviously, studying the effects of interconnection process parameters on the performance of microwave circuit transmission is of far-reaching significance.Firstly, with splicing processing as the research object, from the perspective of field-circuit coupling, this paper puts forward an analysis method. First, by analyzing its theoretical equivalent circuit analysis, to get mathematical model circuit parameters; second, to establish electromagnetic model of process parameters; third, the model is simulated under different frequency bands and structural parameters, Finally, after the data processing, the qualitative and quantitative impact mechanism of splicing gap on RF transmission properties in passive microstrip can be given. In this model, in S, X, Ku-band, gap width should be controlled within 0.2mm, 0.15 mm and 0.05 mm. Finally, we carry out sample validation to confirm our conclusion strongly.Then, bolted will be seen as research objects, we can get deformation for microstrip circuit by its random vibration analysis. To the deformation for microstrip circuit, this paper presents a mathematical method of deformed surface fitting, and gets the mathematical equations of deformed surface; next, by the calculating of electromagnetic modeling, the effect mechanism of substrate deformation for passive microstrip circuit transmission performance can be gotten. Then, from the perspective of the field-circuit coupling, the bolt distribution is manual tuning; using the same methods to analyze microstrip circuit transmission performance after the bolt distribution is manual tuning. By comparison of the data, we can get the conclusion that the deformation of the substrate can be reduced by controlling the number of bolts and mounting position to ensure the transmission performance of microwave circuits, and try to make bolt away from active devices, near the edge is a good position to ensure the stability.Finally, with soldering as the research object, a comprehensive analysis of soldering voids is proposed by analyzing the typical cylindrical voids. Through the establishment of voiding electromagnetic model, this paper does the research from thee aspects, such as voids positions, voids structure, voids number and soldering ratio, finally points out that in practical engineering, soldering voids should be avoided at the edge of feeding port and soldering, with the increase of soldering ratio, Insertion Loss and VSWR of micro-strip line decreased, when soldering ratio reaches 40%, the requirements are not met, and the voltage standing wave ratio is more sensitive to the impact of soldering voids. |
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