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Design And Analysis Of Compact Heat Dissipation Structure

Posted on:2018-11-16Degree:MasterType:Thesis
Country:ChinaCandidate:S R ChenFull Text:PDF
GTID:2322330536477527Subject:Marine Engineering
Abstract/Summary:PDF Full Text Request
With the development of electronic technology,compact electronic equipment has become a future development trend,which makes the electronic equipment in a limited space,the heat flux accelerate and the working environment become more and more bad.Therefore,how to protect the electronic equipment can be efficient,long-term,stable operation,which poses a huge challenge to the thermal design of electronic equipment.This paper focuses on the design and analysis of compact thermal structures,around the thermal design of the sealed electronic chassis,cooling of T/R component and heat pipe radiator for motor controller.Set up fluid structure coupling model and thermal structure coupling model,and proceed numerical simulation of variable parameters,so as to analyze and evaluate the heat dissipation performance of the compact heat dissipation structure.The heat of source generated during operation mainly relies on heat conduction to the bottom of the chassis floor,and then through the radiator heat dissipation into the external environment,so as to achieve the purpose of cooling.On the basis of heat transfer and hydrodynamics,the structure of the chassis radiator is designed and the numerical model is established,and analyzes the simulation results.Clear the effects of fin spacing,thickness,height,spacing and floor thickness on the radiator performance,the best parameters are obtained by orthogonal test,by comparing the experimental data with the results of numerical calculations,verify the rationality and feasibility of thermal design.According to the specific T/R component distribution design of the corresponding flow channel,check the highest temperature pressure drop.On the basis of the original flow channel,two kinds of liquid cooler models are designed and calculation.The result shows: the longer the flow path is,the better the cooling effect is,and the greater the pressure;the more the runner elbow,the higher the degree of turbulence,the better the heat transfer performance,and the greater the pressure.Through the design and analysis of the thermal structure of T/R components,provides a reference for such engineering applications.The heat pipe cooling scheme is proposed on the basis of the liquid cooling of the motor driver,based on the theoretical calculation,the heat pipe radiator model is established,and calculated the radiator.On the basis of the original model,the influence of different wind speed and inlet modes was analyzed.The results show that the heat pipe radiator improves the working environment of the motor driver.This paper has a certain practicality for the design and analysis of the compact heat dissipation structure,which can provide some experience reference for similar engineering practice,so as to improve the performance and life of the equipment.
Keywords/Search Tags:Thermal design, Electronic equipment cooling, Compact
PDF Full Text Request
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