Research On Cooling Technology And Numerical Simulation Research On Components Layout Optimizationfor Sealed Electronic Devices

Due to the developing trend of the electronic industry that is featured withhigh-performance, micromation and integration, the issue concerned with electroniccomponents cooling has become more and more irreconcilable, especially for thesetechnically novel and sophisticated products. Electronic components will irreversiblyevolve to be highly-intensified, highly-integrated, highly-frequent and moreminiaturized, which will inevitably entail more heat radiation. Besides, many devicesare usually sealed in a server environment for the purpose of dust-proof, moistureresistance and water-proof. This kind of treatment deteriorates the inside operatingenvironment of these devices. Apparently, the electronic components cooling issueemerges as the generally recognized handicap against the development of the electronicdevelopment, especially the cooling problem for sealed electronic devices. It serves achallenge and an opportunity both for the evolution of electronic devices at the samethreshold. Confronted with this challenge, the thermo-tube cooling control technologydistinguishes itself with a unique edge. This technology will be applicable fortemperature control in a sealed space in effective way while ensuing electronic devicesare perfectly sealed, dust-proof and moisture resistant. This paper will focus on thetheme of Numerical Simulation and Experimental Research on Efficient ThermalDesign for Sealed Electronic Devices, and will be dedicated to the issue of how todesign the heat transfer circuit for heat radiators. The innovative concern of this paperwill shed light on an optimal match between a heat source and corresponding cooingenvironment as a reliable temperature allocating system for electronic components anddevices.This research will mainly focus on the aspects as follows:1. The efficient thermal design will be conducted with a purpose of reducing thereverse influence the temperature change has on the operating performance so that theelectronic devices can be applicable under the circumstance of a wide temperature range.Therefore, effective cooling technology will be preferentially adopted in the designcourse. This paper demonstrates a comprehensive summary on the primary technologyand progress on the study of thermal designs for electronic devices. Based on theresearch, thermo-tube technology counts to the most effective solution in terms ofcooling technology, and is also the most feasible plan for massive production,standardization and serialization.2. The efficient thermal design for electronic devices is based on the notion of findingan optimal match between the inside heat radiating components and the correspondingcooling environment. Thus, this paper will discuss many issues like the calculation onthe inside temperature field of electronic devices, the heat radiation rules under variouscircumstances, the corresponding stable heat radiation models and thermal analyzingsoftware, etc. It is conducted with a purpose of providing theoretic basis and references for a more efficient forecast on the working temperature, including environmenttemperature and component surface temperature, of electronic devices in a moreefficient way and an optimized thermal design.3. The structural modification design for a heat radiator stands with a greatsignificance in the highly efficient thermal design for electronic devices. In practice, thedesign of a heat radiator directly determines the efficiency of the thermal design of asystem. Up until now, most thermal-tube heat radiators have still been designed inaccordance to a conventional practice. The parameters used for the design of athermal-tube heat radiator have been adopted in random, which might make a greatdisturbance to the operating performance and heat transferring performance in thepractical application of these designs. Therefore, how to design a heat radiator that iscompetent for electronic components cooling, and optimize its structure, has emerged atthe top agenda of the heat radiator design for electronic devices. Based on the theory ofthermal resistance model for thermal-tube heat transfer, this paper has established a heattransfer model to calculate the parameters and values of a thermal-tube heat radiator. Italso analyzes the heat transferring performance of the thermal-tube heat radiatoraccording to these parameters, so as to optimize its structure and reach many valuableconclusions in that aspect. These conclusions will be applied as the theoretical basis inthe course of the mass production, standardization and serialization in near future.4. The discussion regarding the influence various heat radiators and the electronicdevices’ inside layouts cast on the heat radiating performances is crucial in the course ofthermal design and analysis. In fact, a modified layout of the electronic componentsinside a device also contributes to a more reliable performance of the electronic deviceby effectively reducing components’ external thermal resistance and the temperature onits surface given the same structure. According to these research results mentionedabove, this paper adopts a certain sealed electronic device as an example to establish alumped parameter mathematical model for the heat control nested structure of a sealedelectronic device. In addition, this research also conducts a thermal simulative analysiswith professional thermal analysis software like SINDA/FLUINT on the electroniclayout of the device. The optimal modifying solution on heat radiation design is reachedthrough sophisticated calculation and analysis toward assorted modified structuremodels.5. The experimental testing devices are erected in this research to measure theintegrated performances for both thermal-tube heat radiator and thermal-tube sealedelectronic device. The final optimal heat radiation plan is verified by the contrastiveanalysis regarding the thermal simulative results and the practical thermal measurementdata.