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Research On 3D Deformation Synchronous Measurement Based On Spatial-carrier Technology

Posted on:2017-01-18Degree:MasterType:Thesis
Country:ChinaCandidate:Y X LiuFull Text:PDF
GTID:2308330485997350Subject:Measuring and Testing Technology and Instruments
Abstract/Summary:PDF Full Text Request
Digital speckle interferometry is a kind of real-time, non-contact, and high-precision measurement technique, which has been widely used and developed in the fields of aerospace.For obtaining more accuracy measurement information,he dynamic deformati ons in multi-dimension are required in many fields. However, traditional digital speckle interferometry cannot achieve dynamic measurement and cannot realize the simultaneous measurement of 3D deformation as well.In this paper, a multi-illumination based 3D deformation dynamic measurement system of spatial carrier digital speckle interferometry is developed. The measurement principle and the structure of optical system are described. The key technique of the system is studied, and the experimental measurements are made. The main research work in this paper are as follows:Speckle interferometry principle and phase measurement techniques are analyzed, compared and experimented. The 3D deformation speckle interferometry is discussed, which provides the theoretical basis for multi-source based 3D synchronous and dynamic measurement system.The key parameters affecting the spectrum distribution of the spatial carrier method are studied and analyzed. The formula for the influence of the aperture value and the reference light angle is derived. The range of its value is determined and the value of each parameter is verified.With above analysis, a dynamic 3D measurement system based on multi-illumination laser speckle interferometry is designed and built. The optical path system and measurement principle are introduced detailedly, and the key techniques are studied and analyzed.Experimental study and comparison of the multi-illumination speckle interferometry system are conducted. The accuracy and stability of the system are validated. The static deformation, thermal deformation and continuous loading deformation experiments are carried out. The performance of synchronous dynamic measurement is validated.
Keywords/Search Tags:Digital speckle pattern interferometry, Multi-illumination, Spatial carrier, 3D deformation measurement, Synchronous dynamic measurement
PDF Full Text Request
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