Research Of Three-dimensional Deformation Dynamic Measurement System Based On DSPI

Using optical technology to obtain a three-dimensional deformation information is a very important research area. It has broad application prospects in the area of aerospace, biomedical, chemical materials, civil engineering and so on. The digital speckle pattern interferometry (DSPI) is a whole-field, non-contact, high-precision measurement technique compared with traditional deformation measurement methods. Therefore, DSPI has more and more application and development in the field of three-dimensional deformation measurement.In order to measure three-dimension deformation of the tiny object(10*10mm), this paper studies the digital speckle pattern interferometry dimensional deformation measurement techniques, as well as research and design works of three-dimensional DSPI measurement system, mainly as follows:1 The research status of digital speckle pattern interferometry dimensional deformation measurement techniques were studied and analyzed. Based on the research status, a single light source spectral-dimensional DSPI system was proposed in the paper in order to measure the tiny three-dimensional deformation of the object.2 The key image processing techniques of digital speckle pattern interferogram are studied. For phase measurement, the paper proposed spatial carrier phase deflection technology based on deflection angle. Fast phase detection implemented through a single speckle interference image. The method saves calculation times, effectively improve the shortcomings of only static or quasi-static measurement environment applied for time phase shift technique.3 Optical measurement system is built for in-plane, out-plane and three-dimensional deformation detect based on digital speckle pattern interferometry technology. Three-dimensional DSPI instrument is designed and processed on the basis of a single light source spectral measurement system. According to the system’s measuring principle, it is required to analyze and select the devices. After devices selection, the way of device’s installation and fixation will be designed for mechanical structure manufacturing. Ultimately, three-dimensional measurement instrument will be assembled and debugged.4 A series of experimental study is need to done to measure the three-dimensional deformation of test specimen, after the complement of three-dimensional DSPI measurement system’s assembly. Experimental results show that the three-dimensional DSPI deformation measurement system can be used measure the tiny three-dimensional deformation of the object.