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The Research Of The Key Technology On The Miniaturization Of Multi-Channel T/R Moudules

Posted on:2017-03-04Degree:MasterType:Thesis
Country:ChinaCandidate:C ZhangFull Text:PDF
GTID:2308330485986134Subject:Electromagnetic field and microwave technology
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Multi-channel T/R modules is an important part of a phased array radar. Its size largely affects the volume of phased array radar. So the miniaturization of multi-channel T/R modules research has very important significance on the realization of miniaturization of PAR. The rapid development of LTCC(low temperature co-firing ceramic) techniques and 3D-MCM(3D Multi-Chip Module) in recent years give us another way to realize the miniaturization of the T/R modules.Based on the theory of transmission line theory, Wilkinson power splitters and other related theory and combined with LTCC technology, multilayer PCB technology and 3D-MCM technology, the thesis have carried out on key technology in the realization of multi-channel T/R modules miniaturization by LTCC and 3D-MCM technology, and obtain the following results:(1)By using LTCC technology, the thesis have designed a ka-band multi-beam synthetic module. Thesis have do much research on stripline vertical interconnection between the layers, microstrip-stripline transition, and presents the general model of the structure, and proves the feasibility and the accuracy of the model through the experiment(2)3D-MCM technology is used and multilayer PCB technology, to realize the multi-channel T/R modules of miniaturization has conducted in-depth exploration and research. Completed the stripline Wilkinson power splitters, microstrip line to the stripline vertical structure and the structure of the vertical panel is interconnected. And between the practicability and reliability of the vertical interconnection structure was validated through the experiment.(3)Combined with 3D-MCM technology, we have made the related design and research on the vertical multichip module technology. By using HFSS to simulate and optimize, we complete the design and processing of vertical interconnections between the board structure. The measured results show that the design of the vertical interconnections structure can achieve well transmission performance and has certain engineering application value.
Keywords/Search Tags:Miniaturization, LTCC technology, 3D-MCM technology, the vertical interconnect structure
PDF Full Text Request
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