Research On Design Of LTCC Circuit

In recent years, miniaturization and integration are the trends of the electronic product, especially in the wireless communication industry. Low temperature co-fired ceramic (LTCC) technology is a product with these features. It has become popular, with its excellent electrical performance at RF and microwave frequencies. And it has became an important technology of passive integration.In china, however, most of the LTCC products are imports. One of the reasons is that LTCC design technology is not advanced.A lot of research has been done on design technology of LTCC in this paper, which aimed at the commercial applications and industrialization. The key technology and solution are discussed, which focus on how to construct the embedded 3D models of the passive elements and the influence matters of manufacturing process.The embedded 3D structures including inductors, capacitors and coupling lines are discussed, and they are compared with each other, Then the miniaturization solution is presented.The influence matters of manufacturing process must be taken into account when we are doing the LTCC product designing work. The influence matters, such as line width and space, displacement, shrinkage, meshed ground, and so on, are discussed, as well as their corresponding solutions.Then, a chip-type Marchand balun, which uses semi-lumped concept and LTCC technology, is presented. How to reduce the size is discussed and the 3D structure is presented. And the measured results and the results of computer simulation show a good match. It has excellent performance, with small size, low insertion loss and good amplitude balance. This design is not sensitive to manufacturing process, and it can be mass-produced.