TDG Holding Company Double-sided Polishing Machine Control System Design And Implementation

Double-sided polishing machine is mainly suitable for semiconductor silicon wafers, magnetic materials, sapphire, optical glass, metal and other hard brittle materials double-sided high-precision high efficiency polishing processing. With four dynamic polishing principle; 2 motor drag respectively in selling, the sun wheel, gear ring; PLC adjust set control; Color NT showing the human-machine interface system. Longman box construction with high power reduction system, soft start, soft stop, smooth operation, polishing time according to the timer can be set at random, using the automatic polishing liquid supply device. Parts in contact with the polishing liquid chose anticorrosive material or surface has carried on the special treatment. By precision weighing sensor with high precision pneumatic control system to realize the pressure closed loop feedback control, to ensure the accuracy of the stress of workspace. Major sports vice adopted forced lubrication. Polishing liquid system with independent stirring, circulating water cooling, polishing liquid heating and polishing liquid temperature detection function, the function is optional.Two sided polishing process is an effective way to smooth the surface of the wafer, and has received extensive attention. How to effectively obtain the smooth surface of the wafer has become a hot spot of the experts and scholars of all walks of life. The pneumatic loading system of the double side polishing machine can accurately control the super smooth surface of the wafer, and improve the quality of the super smooth surface of the wafer.The loading device is an important part of the double side polishing process, which determines the quality of the super smooth surface of the wafer. In this paper, the control system is designed and implemented according to the actual demand. Firstly, this paper introduces the basic theory of the double side polishing machine. The control theory is studied. The hardware design and software design of the system are described in detail. The function and task of the system are analyzed; In this paper, a double side polishing machine is studied. Two working modes of manual and automatic control are put forward. The overall scheme of the software is designed, and the program of the system is designed; the polishing machine monitoring system is designed to realize the real-time monitoring and maintenance of the system. At last, the interface of the system is designed to determine the switching relationship between the screen and the system.After debugging the system, it is proved that the system function is running normally, meet the predetermined functional objectives, the system has a strong stability in operation, meet the requirements of the wafer super smooth surface processing, and enhance the quality of the wafer super smooth surface processing. Through the design and implementation of this system, we hope to lay the foundation for the future research of the two sided polishing process control system.