Semiconductor Unit Test Escape

With the change of modern science and technology, new moon, have become increasingly demanding semiconductor technology,semiconductor devices are becoming smaller, the minimum of plastic devices can reach 0.2*0.4mm; more light weight, price is also more and more low. But due to the semiconductor device itself is a non hermetic package form, when used in areas requiring high reliability, still cautious, must for plastic encapsulated semiconductor device inherent failure mode, determine the strict quality assurance program. So the research and development of the test system plays an important role in the research of semiconductor, and the requirement of stability, accuracy and testing speed of the system is higher and higher. And because of chip and molding process inherent in the some problems associated with the use of field, the ability test equipment requirements not only simple screening out problem of device function, and we need to study how to identify hidden some packaging technology difficult problem.First of all, this paper briefly discusses the development of semiconductor industry and testing system, introduces the company’s testing machine and packaging equipment, and the whole test process. Then using the fishbone diagram analysis method to find the main factors affecting the test run. From measuring equipment between the communication circuit(taping machine, packaging machine and test equipment of communication); test equipment device itself inherent problems and the operation personnel, the three analog sampling and optimized, finally found test escapes the root cause of. According to software development, improve test equipment self monitoring and use of anti- stupid method to prevent operating personnel, these two aspects to solve the test run(not 100% tested the functional failure of the products and will be the function failure of the product packaging tape sent to the customer, the problem we call for the test run. Problems. For the company to save costs and make high-quality products to win more customers.In order to solve the problem of test and escape, we will find a more reasonable solution by the following 3 experiments to verify.Experiment a: according to the analysis of test machine circuit relay on the test voltage and current due to the influence of the test problems, data obtained through the company’s data acquisition of microscope using data analysis software, experimental analysis is carried out to find the desired result.Experiment two: according to the difference of the test program, the test problem is caused to test and collect the data. The experiment is conducted to find out the source of the problem and design the solution.Experiment three: analysis of the causes of the problem, through the experiment to find a reasonable place for equipment design. And designed to solve the problem of the experimentFinally through the test of the circuit board of the test, built network, develop software to simplify the operating system and the design POKA YOKA to solve the test escape issue.