Design And Implementation Of A Power Pulse Semiconductor Laser Driver Module

Pulse semiconductor lasers are widely used in many fields such as pulse laser ranging, laser radars, diode pumped solid state lasers(DPSSL), impulse Doppler imaging and etc. With the rapid development and widespread use, pulse semiconductor lasers have become the core components in optoelectronics. And one of the main research directions for pulse semiconductor lasers is to make their drive circuits more optimized, cheaper, smaller and more practical.Drive circuits should be modularized and assembled in hybrid integrated circuit(HIC) style to shrink their physical size for users’ convenience.This research is not only to design the drive circuits but also to hybrid integrate them. Thus this paper researches and discusses in two aspects: circuit design and hybrid integration technology.For the circuit design part, this paper analyzes several typical laser drive circuits and designs a set of pulse semiconductor laser drive circuit which meets the requirement. This drive circuit is mainly composed by the following five parts: the power supply line, the pulse generating circuit, the pulse shaping circuit, the power amplifying circuit and the ESD protection circuit. First, the power supply line adjusts the input voltage to 5V for other components to use. Next the pulse generating circuit, which is composed by SN74123, transforms the square signal into the pulse signal with the same frequency. Then the pulse shaping circuit, which is composed by transistor N182 and P182, amplifies the signal. Finally, the output pulse signal, which works as the switch signal of metal-oxide semiconductor field-effect transistor(MOSFET), drives the pulse semiconductor laser.For the technical realization, this drive circuit adopts HIC craft for manufacturing. The circuit board adopts aluminum oxide ceramic board. The circuit line adopts film gold layer and thin-film resistor for wiring. The components include chip multi-layer capacitors, chip resistors and bare chips. The inner bonding is welded by 25 um gold wire bonding. The packaging housing adopts the medal DIP. The parallel seam welding is conducted in the high purity nitrogen to guarantee the inner stable atmosphere of all the components. This paper analyzes the hybrid integrated circuit technology’s impact on the electrical characteristics and reliability, and the corresponding experiments are carried out. In the end, a manufacture craft solution which is fit for production and also meets the requirement of the components’ quality and reliability comes out.After a series of electrical parameter tests and filtering tests, it is confirmed that this drive circuit can fully satisfy the requirement of design and use.