| The display technology has transited from the bulky cathode ray tube(CRT) display to the flat panel liguid crystal display(LCD). Being flexible is regarded as one of key trends for future development of display technologies. Compared with the rigid display technology, the flexible display technology can offer sveral unparalleled advantages. But the flexible display panel needs external deriver chips to provide the required driving and control signals. Therefore, the bonding of the rigid driver chips onto the flexible substrate with robsust electrical connections is one of key issues to be addressed for developing flexible displays.In the thiesis, the existing chip assembly techinologies are reviewed firstly. The based on the processiong limitations of the popular flexible plastic substrates, the possible technologies of achieving reliable interconnections between the driver chips and electronics on flexible substrates are comprehensively analyzed and compared. The anisotropic conductive film(ACF) bonding is finally thought to be a proper solution.The ACF bonding solution’s reliability, feasibility and electrical performacne can be verified by this DoE plan from both qualitative and quantitative point of view. And finally, the positive experiment reulst will show that this solution match the flexible display interconnection’s entire requirement.The significance of this experiment is to demonstrate the ACF bonding solution which is the most popular maturity assembly process in liquid crystal display can be transferred to flexible display. |
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