Research On Multiphysics Simulation Optimization Technology For Wideband Low Phase Noise Frequency Synthesizer SiP

As a frequency synthesizer,it has always been an important part of communication and radar systems.With the development of integrated circuits and the miniaturization of microwave devices,the miniaturization of it is also an important development trend.SiP technology can better meet the requirements of modern products for miniaturization of electronic packaging.Multi-physics coupling analysis can predict the coupling effect between multiple physics caused by volume reduction,thus improving the reliability of design.This paper firstly investigates the development status.The frequency synthesis theory is introduced.The advantages and disadvantages of various frequency synthesis methods are analyzed.The phase-locked loop is introduced.The principle of full-wave electromagnetic analysis,the basic principle of heat transfer,the stress-related equations and the electromagnetic-thermal-stress coupling relationship of the frequency synthesizer SiP are introduced.The design of the double loop architecture of the large step ring plus the mixing frequency loop is determined.The frequency synthesizer SiP has a high integration density and a complex physical environment.Through the analysis of the multi-physical coupling relationship,the multi-physical coupling analysis method and the simulation model is proposed.The electromagnetic-thermal-stress coupling simulation analysis of a series of multi-physics reliability problems of frequency synthesizer SiP is carried out.The heat dissipation structure is analyzed and researched,and the frequency synthesizer is optimized by using a buried copper structure.The frequency synthesizer,s output frequency range is 4-6GHz,its phase noise is better than-110dBc/Hz@10kHz,its spur power in 1GHz span is less than-90dBc.The test results show that the error between the real temperature and the simulation result of the frequency synthesizer SiP is less than 9%.The electromagnetic characteristics and stress also satisfies the constraint conditions.The multi-physics coupling analysis method and the modeling simulation process is feasible to analyze multi-physics reliability problems.