The Design Of Ultrasonic Laser Processing Equipment And Its Application In Material Processing

The ultrasonic machining and laser processing are a non-traditional machining, more common in these years. Since its good processing advantages, they have been widely used in aerospace, electronic circuit device and precision machinery and other industries. Its working principle: it uses laser processing as the main processing and ultrasonic vibration system for secondary processing. The ultrasonic signal incentive sample for micron level of high frequency vibration while laser processing. Due to the object do high frequency vibration, air flow laser processing area was speeding up, and the residue was thrown out, that on the one hand, improved the utilization rate of the laser, on the other hand, reduced slag residual recasting forms on the surface of processing. Study on ultrasonic assisted laser processing is still relatively few, some scholars have done research on the machining mechanism, there is not a complete plan about the design and manufacture of ultrasonic assisted laser processing device. Based on this, the design and manufacture of ultrasonic assisted laser processing device as follows:(1) We have summarized current situation of ultrasound-assisted laser processing domestic and foreign, proposed ultrasonic vibration assisted system design requirements. For the design of the ultrasonic vibration system can be achieved assisted laser processing easily, can inspire the along the vertical direction vibration of micron when processing, the system can easily be made vibration parameters adjustment and change in different processing conditions.(2) We carried on the finite element analysis of ultrasonic vibration system, obtained the optimal parameters of ultrasonic vibration the system selection. Mainly includes the size of the selected vibration plate 250mm×150mm×1.5mm, transducers using three frequency 28 KHz vibration plate uniformly arranged along the midline approach was selected, ultrasonic vibration system can achieve high frequency vibration amplitude of 3.89μm by the finite element analysis.(3) We designed and developed the whole device of ultrasonic vibration system, have chosen the electrodeless frequency modulation ultrasonic generator, design and manufacture of the ultrasonic vibration system, including processing box, fixture design, on the whole device for debugging.(4) We have developed a system to measure the amplitude of the ultrasonic vibration, the first designed and built with a piezoelectric acceleration sensor measuring the amplitude of the device, with its draw system can achieve high frequency vibration amplitude 3.59μm. On silicon nitride ceramic cutting with ultrasonic assisted laser processing equipment, the test results, a deeper groove ultrasonic, microstructure at the bottom of the groove is better than that without ultrasonic assisted. A new composite processing technology was studied, in order to make up the shortage of the laser processing, the ultrasonic vibration is introduced in laser processing, it has high application value for cutting, drilling and other processing difficult machining materials, to meet the high quality requirements of materials processing, to achieve a better composite effect by providing a dedicated composite plant equipment.