Study For Anti-oxidation Of Copper Electrical Paste Sintered In High Temperature

In order to protect Cu against oxdation in the room temperature even high temperature atmosphere,a process was proposed in this study that the Cu powder was coated with borosilicate glass by sol-gel process. From the sol-gel process, we could obtain that different proportion on catalyst and formula,temperature of SiO2-B2O3 sol have a lot influence on SiO2-B2O3 While HCl was used as catalyst,heated at 50℃, the stable sol-gel wihout sediment was obtained by the hydrolysis of tributyl borate(PIBP) and orthosilicate.The melting point of borosilicate glass meet the criterion of Cu paste while n(TEOS)：n(无水乙醇)：n(水)：n(盐酸)：n(硼酸三丁酯)=1:1.2:20:0.02:1.2.The conductivity and anti-oxidability of the Cu powder coated with borosilicate glass were studied by scanning electron microscope(SEM),compaction resistance, X-ray diffractometer(XRD), thermogravimetric analysis(TG),etc. when m(SiO2-B2O3):m(Cu)=10%,the surface of Cu powder was completely coated by borosilicate, the mixture of them have high conductivity which relative electric leakage is 57.While Cu powder which coated with SiO2-B2O3 sol at 10 percent of the mixture of SiO2-B2O3 and Cu was used as conductive filler,and terpineol-ethyl cellulose was used as organic vehicle,copper electrical paste was obtained based on the above research.The influence of the organic vehicle and conductive filler, granular size of Copper powder on conductivity and anti-oxidability of copper electrical paste emerged in the test through the technology of XRD, SEM, adhesion testing, The results shows that copper electrical paste has good conductivity,printing performance and its adhesive force is more than 12N whilem(乙基纤维素)：m(松油醇)=5：82,m(Cu)：m(有机载体)= 4:1.