Preparation And Stability Study Of Copper Based Electrical Conductive Paste

With the rapid development of electron information business, the boost of electrical conductive paste is more and more urgent. Electrical conductive paste is a high technology electronic function material, including technique of metallurgy, chemical engineering and electron. As the fundamental and critical functional material for varies electron devices, Electrical conductive paste has been widely used in mechanism, electrics and telecommunication. So, the study of electrical conductive paste is very significant. The element of electrically conductive paste was reviewed. The work presented in the paper focuses on electrical conductive paste by experiment. According to the factors influencing of the electrically conductive paste were discussed, the effect of fillers, resin, percolation threshold and different content of coupling agent on the electrically conductive paste during the preparation were researched. A special organic film was coated on the surface of the micro copper powder and the silver- plated copper powder in electrical conductive paste to anti-oxidize them and the anti-oxidize capacities of products were tested though Scanning Electronic Microscope Analysis, X-ray Diffraction analysis, thermal gravimetric analysis, accelerated aging test and electric conductivity test. The results showed that the electrical conductive paste with the anti-oxygenation of micro Cu-Ag bimetallic powder with organic-film had the optimal anti-oxidize capacity. The experiment results indicated that the electrical paste conductive has several merits: simple process, high stability and well conductive property. After 1000 hours test at room temperature, 200 hours oxidization at 100℃and 48 hours oxidization at 120℃, humidity level of 80%, the characteristics of electrical conductive paste can meet the applied demand.