Encapsulating Technology Investigation Of Organic Diodes And Field-effect Transistors Based On Copper Phthalocyanine

The research for organic electronic devices, with the continuous research of organic semiconductor materials and the continuous improvement of preparation process, have achieved remarkable results. Due to the superiority of the performance and characteristics of organic electronic devices (such as flexible, low-cost, simple preparation process, etc.), they have had wide application prospect in many fields. But the lifetime and stability of organic electronic devices is still a very troublesome problem, and therefore has attracted wide concern and research. In this thesis, hybrid thin film encapsulation were studied mainly based on different packaging methods and structures. Without affecting device performance, the lifetime and stability of the devices have been improved. The thesis mainly includes the following contents:1. The introduction of the basic structures, working principles, performance parameters of organic field effect transistors and organic diodes; the analysis of the cause of the failure of semiconductor and electrode materials in organic devices and the problems to solve.2. The summary and introduction of the several main packaging methods, packaging technologies and packaging structures; the preparation of copper phthalocyanine organic diodes, and then the encapsulation using the traditional glass back cover encapsulation structure, hybrid thin film encapsulation structure of spin coated PVA organic thin film and LiF thin film deposited by thermal evaporation, mixed film structure thermal evaporated LiF films and Er2O3 films prepared by RF magnetron sputtering, finding that after packaging, the performance has been improved to a certain extent.3. The preparation of the CuPc/C60-OFETs heterojunction devices and the encapsulation of the hybrid thermally evaporated LiF films and Er2O3 films by magnetron sputtering after contrast analysis. Through the testing and characterization of device performance after encapsulation, it was found the device lifetime and stability have been significantly improved.