Metal Layer Of 0.18um Semiconductor Technology MUV Lithography Technology Research And Optimization

The lithography process is one of the most important process steps for semiconductor manufacturing. The cost of lithography is about 30% of the whole wafer manufacturing process. At the present, ArF/DUV/MUV is three main expose tool in FAB in our country. ArF is used for the 0.11-0.09um product, DUV is mainly applied to 0.11-0.18um product, and MUV machine is usually responsible for large line width process. MUV cost is lower than that of ArF and DUV. The width of products in our country are between 0.05um and 0.3um process, due to the limit of capability for expose tool, DUV takes the main role in 0.1um and 0.3um product, but the DUV tool and material are most expensive than MUV.Based on advance photo technology, we study the project that MUV backup DUV from DARC optimized、resist thickness optimized、expose condition optimized、develop recipe and OPC technology optimized to improve MUV process capacity. It is available from the simulation data and inline data. This project will reduce DUV work loading, and increase capacity of production and reduce Production costs.