Structure Design For A Multi-Bonding Head Of Plane LED Die Bonder

For the current market, the LED die bonder machine are a single bonding head and suction nozzle. So, in this paper, we designed a multi-nozzle bonding head of die bonder. Compared with the other die bonder, It can continue pick and bond, so, its speed and accuracy are greatly increased. The design of the mechanism is analyzed with the virtual prototyping technology and the finite element analysis, the results meet the requirements of bonding process. This design has some theoretical and practical value.The die bonder designed in this paper is composed of seven mechanisms. Seven mechanisms are:multi-nozzle bonding head mechanisms, dispensing mechanism, ejector mechanism, X-Y work table mechanism, wafer transfer mechanism, CCD mechanism and other mechanism. This paper mainly completes the following aspects of the work:(1) Design for multi-nozzle bonding headBonding head mechanism is the most important part of die bonder, its performance directly determines the performance of die bonder. Analysis of the working principle of bonding head. he leakage detection in the process of bonding is finished by the principle of the photoelectric sensor; Use of electromagnetic valve closed and open to produce vacuum and blowing finished wafer pick and bond; Use spring to absorbing buffer; The design of the multi-nozzle bonding mechanism provides two working modes, in working mode one, adopt 8 nozzle structure, bonding mechanism each step can be completed pick and bond. in working mode two, adopt 4 nozzle structure and 4 dispensing head, Bonding mechanism each two step can be completed pick epoxy, dispensing, pick die and bonding. In this paper, the design of 8 nozzle head mechanism depend on working mode one.The bonding head mechanism’s rotary motion components using Direct Drive Rotation motor, it has a high repeat positioning accuracy, high acceleration, maintenance-free characteristics. That can greatly improve the performance of the bonding mechanism. Z direction moving parts of bonding head mechanism with high precision miniature LM rolling guide. Rotary electrical interface component of bonding mechanism using gas-electric rotary joint, effective solution to the continuous rotation cause electrical wiring and pipe tangling.(2) Design of other mechanism structureThe other part of the die bonder include:X-Y work table, ejector mechanism, wafer feeding mechanism, the dispensing mechanism, CCD optical lens and the adjustment mechanism and other components. This paper mainly describe X-Y work table, ejector mechanism, wafer feeding mechanism principle and structure design.X-Y work table drive by servo motor, ball screw, and use of linear guide slide to complete the bearing and orientation. The X-Y work table also can adjustment height, and can adapt to the different specifications of the LED frame. The mechanism has the features of quick response, high accuracy and general purpose.The ejector mechanism adopts eccentric wheel mechanism and precision V type guide combination, by the stepper motor through the coupling directly drive. Simple structure, low cost, can meet the needs of the chip eject.The next part of the wafer feeding mechanism is the X-Y workbench in series, which can realize the precise fine adjustment of the position, and the upper part is the wafer ring of the cantilever structure, which is used for placing and fixing the wafer.This paper uses CAD\CAE integration environment, In this paper, the integrated use CAD\CAE integrated environment, the plane type LED multi-nozzle die bonder of systematic analysis and design research are carried out. Using 3D software Solid Works2013 to modeling and virtual assembly. Combined with the finite element analysis software ANSYS 14.0, modal analysis for the key part of bonding head mechanism, determine the natural frequencies and mode shapes. Establish flexible body, and finally use software ADAMS 2012 to simulation analysis of multi nozzle bonding head mechanism, obtained the suction nozzle in pick and bond position of the contact force, Thereby cartifying the mechanism meets the design requirements.