The Test System And Experiment Research Of Immersion Cooling Model

With the rapid development of electronic information industry and related process technology, the phenomenal increases in clock speed, processing speed and transistors density, while decreasing the size and surface area, have significantly increased the heat flux of electronic chips. As the same time, the electronic chips’ working temperature and surface temperature uniform has not been improved as a result of a degree of hysteresis of electronic chip heat design, which can influence electronic chips’ normal performance seriously.In immersion cooling method, the cooling liquid can contact the printed circuit board directly without thermal medium between them. Immersion cooling method can keep electronic chips’ surface temperature and temperature difference lower than other ways at a higher efficiency, which can reduce thermal stresses, improve relativity and increase the service time of electronic chip. Because of exposed joints, this cooling liquid must be dielectric liquid, whose thermal conductivity is lower than ionic compounds. To ensure that high speed processor work normally and continuously, heat dissipation with a higher efficiency must be invented. In this paper, a test system of immersion cooling model has been designed based on immersion cooling theory, aimed to solve heat dissipation of electronic equipment. This paper includes:(1)Physical Model has been established and basic numerical simulation calculation has been carried out by CFD software Fluent.(2)Based on numerical simulation, relative comparative parameters of experimental equipment have been confirmed, furthermore, the performance of experiment devices has also been calculated before testing.(3)The test system has been combined with relative devices, and for different influence elements which are related to heat dissipation of electronic chip, independent test has been conducted.(4)The test system has been evaluated overall and improvements have been brought forward.