Study On Application Of Ice Slurry In Electronic Chip Cooling With High Heat Flux

The research presented that heat flux has reached to 100W/cm2, and the methods of chip cooling commonly used can’t meet the need of cooling chips with ever increasing heat flux at present, to find a high-efficient and low-cost cooling media, and a novel cooling method with high efficiency has been a hot spot in research.In this article, the phase change cooling media of ice slurry will be applied in electronic chip cooling,and the study was carried out two-parts:(1) researching on the experiments of cooling chips with ice slurry of different flow rates flowing through self-designed cooling device.(2) analyzing cooling effects on the chips under conditions that baffle lengths are 55mm, 60mm, 70mm, 80mm, 85mm, 90mm and 93mm respectively and mass flow rates are 0.4kg/s, 0.3kg/s and 0.2kg/s using FLUENT software, and investigating the influences of flow rates and duct sizes on the chip cooling, then analyzing temperature、fluid velocity and pressure distributions. Under the given conditions, the simulation and experimental results have the same trend, and the averaged standard deviations between simulated and experimental stable temperatures of the chips are 2% -5%.The results indicate that: (1) when the flow rate of ice slurry increases, the cooling rate increases and the temperature decreases, under the same condition, the cooling rate with ice slurry is 0.7℃/s ,much higher than that of other cooling methods.(2) chips’surface temperature decreases with increasing baffle length while the flow rate is constant. When the baffle lengths are among 55mm, 60mm and 70mm, cooling effect changing is relative gentle. While the baffle length reaches to more than 80mm, there is a severe decrease of chip surface temperature. When L = 90mm, the chip surface temperature is concentrated at 29℃, and the temperature differences among the measuring points reduced to 1.1℃comparing with 13℃at 55mm length. Then continue to increase L to 93mm, the chip surface temperature decreases, but the temperature distribution is on the State of layered. So considering the cooling effect and uniformity of temperature distribution of the chip surface, the length of baffles should be 83% -93% of the duct. (3) increasing the flow rate of ice slurry and the length of baffles both has a strengthen effect on the chip cooling, but the pressure drop within the flow increases significantly along with increasing of flow rate and baffle length. The cooling effect costs too much comparing with the energy loss, this paper presents the method of selecting the best point combination of the flow rate of ice slurry, the baffle length and the surface temperature.In short, in order to make full use of the latent heat of ice crystals, we should design reasonable conditions which affect the system performance in practice on the premise of effective cooling of the chip and completely melted of ice crystals, so that we can take advantages of ice slurry.