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The Research And Design Of IC Module On-line Cleaning System

Posted on:2012-09-14Degree:MasterType:Thesis
Country:ChinaCandidate:D MiaoFull Text:PDF
GTID:2298330431459963Subject:Control Engineering
Abstract/Summary:PDF Full Text Request
Integrated circuit for electronic product, its quality core components in direct decided to electronic whole products performance and reliability of ruling.In integrated circuit components manufacturing process, microelectronics IC packaging process of high clean cleaning equipment in ensuring the reliability of the product and the stability of the products plays a crucial role in production, and is currently the key process. As integrated circuits get smaller and smaller and the use of advanced materials, surface pollutants seriously affect the product’s performance.Plasma cleaning process has low cost, easy to use, maintenance and maintenance cost low, environmental protection etc, and can be applied to chip bonding process before, fuses bonding and flip chip attache process before surface treatment.In wiring, welding, and filling sealants wait before working procedure, with plasma cleaning effect is prominent.As a kind of precision dry cleaning equipment, plasma cleaner can effectively remove these pollutants, improve material surface properties, increasing the material surface energy.This paper mainly for integrated circuits of the on-line plasma cleaning the design of the system are analyzed.Mainly completes the following job:1.Through the microelectronics packaging manufacturing integrated circuit technology development of introduction,understand the IC manufacturing production process in the importance of the cleaning process.2.Introduces the common industrial cleaning mode,through the plasma cleaning principle, occurrence mode and preparation equipment of introduction,discusses the plasma cleaning equipment is suitable for the IC manufacturing production process.3.According to the integrated circuit manufacturing of on-line plasma cleaning,for the on-line plasma washer on the mechanical structure and control system design.4.To improve the on-line plasma cleaner automation degree and to meet the on-line cleaning method for the key design, have been studiedThrough the above to the on-line plasma cleaning system analysis and introduced, with the existing freestanding plasma cleaning equipment, compared to this equipment has the following advantages:1. High degree of automation and adapt range, suitable for large-scale production2. Cleaning efficiency high, no human factors pollution..Along with the market for IC products reliability and yield of requirements, and constantly improve the market scale expands unceasingly, the original freestanding plasma cleaning process has gradually cannot meet the current requirements.The on-line plasma cleaning technology has become the important means of improving production efficiency.Therefore suitable for online type high efficiency of the plasma cleaning system design and research, in market driving to become the new direction.
Keywords/Search Tags:IC packaging, Plasma cleaning, On-line, Surface treatment, Production efficiency
PDF Full Text Request
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