Optimization Practice Of Automatic Rotary Spray Cleaning Process For IC Chip

With the rapid development of science and technology, the integration of IC improve rapidly, device CD continues to decrease, the surface state of substrate requirements more stringent. The silicon surface state and pollutant removal grade is one of the most important factors affecting the production yield and device quality and reliability. Therefore, to develop cleaning liquid, a new cleaning equipment and new cleaning technology for ultra large integrated circuit requirements is particularly important. For the cleaning of IC production, the common method is used RCA cleaning with multi tanks, it has high efficiency, good effect, no precipitation product advantage. But the disadvantages are clean room occupied large, low efficiency, chemicals and DI water consumption, hard to control etch uniformity, wafer cross contamination serious, low elasticity of equipment tuning, etc. Compared traditional multi tanks cleaning, auto spin cleaner equipment to realize RCA cleaning has advantages of high efficiency, small floor area of equipment, chemicals and water low usage, high process capability of control and particle remove rate, elastic process adjustment characteristics.This thesis base on the study of traditional RCA cleaning method and theory, put forward the improvement of automatic spin spray cleaning machine and optimization of the IC chip cleaning method to improve the cleaning efficiency and the cleaning effect, reduce the chemicals and water usage, to achieve the ideal cleaning effect. The cleaning experiments prove that:By controlling the chemical temperature of the spin spray cleaning, can reduce the silicon damage and improve the ability of wafer cleaning; By tuning the clean steps can avoid the next step process defects by external contamination; By optimization the intermediate rinse of multiple steps cleaning saves too much water and cleaning process time.