Study Of The Heat Transfer Characteristics Of Semiconductor Cooling Box Based On The Natural Convection Heat Pipe Radiator

As a new type environmental and efficient cooling technology, semiconductor refrigeration has the advantages of non-pollution, sound off, compact structure and long life, so it has been widely applied in industrial and civil fields. For now, how to enhance the heat transfer process of the semiconductor, so that improve the COP of semiconductor, is becoming one of hot topics in the study of the semiconductor refrigeration applications. The natural convection heat pipe radiator is composed of heat pipe and fins, has high thermal conductivity and large dissipation area, could be working without auxiliary power unit, hence it is very suitable for the heat dissipation of semiconductor cooling box. In this paper, an experimental study on the heat transfer performance of semiconductor cooling box based on the natural convection heat pipe radiator is carried out, and the structure parameters of the radiator is also optimized through the Fluent software.In order to determine which type of semiconductor has the best refrigeration capacity under the low input power, we compared the refrigeration capacity of three type semiconductor under different input power. Base on the optimal semiconductor and natural convection heat pipe radiator, a series of experiments was carried out to investigate how the structure of radiator, input power, the installation position, the direction of the cold wind affect the heat transfer performance of semiconductor cooling box. Then a simplified physical model about the heat pipe radiator was proposed, and a simulation on the model was conducted through Fluent software. To verify the accuracy of model, we also made an error analysis on simulation results and experimental results. By the mean of simulation, we improved the heat transfer performance of the heat pipe radiator from the fin spacing, the opening rate of fin surface, the heat pipe arrangement, the operating temperature.Summarizing the experiment and simulation results, we can make the following conclusion: the TEC12706 has the best refrigeration capacity when the input power within 50 W. When the structure parameters of semiconductor cooling box is single layer fin, 50 W input power, horizontal installation and cold wind blew to space, the box has the best refrigeration capacity, and the minimum temperature of the box is 2.1 ℃. To obtain the optimal performance, the natural convection heat pipe radiator should keep 5mm fin spacing, 2~3.5% opening rate, cross arrangement of heat pipe. Besides, the performance of the heat pipe radiator is also improved as the operating temperature decreases.