Study On The Heat Dissipation Characteristics Of The Semiconductor Refrigeration Chip And The Heat And Moisture Properties Of The Package

Along with the semiconductor material optimization coefficient increased,the semiconductor refrigeration technology is widely used in national defense,aerospace,medical,microelectronics.The semiconductor refrigeration technology has the advantages of no pollution,low noise,high reliability,easy integration and other advantages,but its efficiency is low,usually single stage semiconductor refrigerator COP between 0.2-0.6,far lower than the vapor compression refrigeration COP value.To widen the range of application and the competitiveness of the semiconductor refrigeration technology mainly lies in the refrigerator performance improvement,such as the improvement of refrigeration capacity and coefficient..At the same time,there is help to forward the semiconductor refrigeration energy-saving direction.In addition,ambient heat,dampness caused by the delamination failure is one of the main failure modes of electronic packaging device,but also affect the reliability of the semiconductor refrigeration technology in hot and humid environment of the main factors.In this paper,a single-stage semiconductor refrigerator as the research object,through the establishment of mathematical model to obtain the cooling capacity,COP under steady-state conditions of parameters solution.And by the numerical simulation a comprehensive analysis of the influence degree of the analytic expressions of the parameters(current,resistance)on the performance of semiconductor refrigerator is done to determine the effect of the main parameters of the semiconductor cooler cooling capacity and COP value and to give the parameters range of the optimal COP value at certain design conditions.Then introduce the semiconductor refrigeration device and method about the cold,hot end variable work conditions,and validate the simulation results according to the experimental data of the cold and hot end heat condition on the performance of the cooler effect.Then according to the material moisture diffusion parameters of common packaging materials in different humidity conditions of temperature and moisture,the diffusion behavior of simple finite element simulation is achieved,obtaining humidity distribution of different packaging materials directly under different conditions and providing a good reference for the design of high reliability semiconductor refrigerator.