The Application Of3D Model In The Signal Integrity Analysis

In recent years, the integration of circuit system and the rate of transmission have a sharp increase with the development of electronics technology. Then the designers has found the traditional circuit design methods do not work well, there are big differences between the actual situation and ideal situation. The signal integrity (SI) has been the key factor in the high-speed designing.This work was supported by a grant from the National Natural Science Foundation of China, using software simulation system design specifications Ansoft HFSS Ansoft Slwave Ansoft Designer. According to the existing software simulation system, hardware platform for all possible trace using three-dimensional models (3D) simulation analysis. Firstly, the basic situation of the existing analytical model and the corresponding algorithm are introdued. The current inaccurate models have lead to many problems. Secondly, the applications of3D models which can be used in vias analysis, the S parameter compensation of capacitance pad and analysis of bondwire have been introduced. Finnally, the2D and3D models have been used to simulate respectively, and the conclusion that the3D model has the higher accurancy than the2D model can be verified by comparing the simulation results of the two models. At the same time, it is found the current models have the inaccuracy issues. So the advanced models should be introduced in the SI simulation for for improving the high-speed digital circuit. And the way for analysing signal quality has also been provided in this paper.