Study On Thermal Characteristic And Fabrication Of Vertical Cavity Surface Emitting Laser With New Structure

The heat problem has restricted the development of vertical cavity surface emitting laser (VCSEL), in order to improve the thermal characteristics of the device, this paper proposes a new bridge electrode on the basis of the conventional circular electrode structure. So that the conductive area and the cooling area of the device are increased, what’s more, the thermal performance of the device has a significant improvement. The two structures were fabricated with the same process in the same epitaxial wafer. At the same time, the internal thermal field distribution of them were analyzed by ANS YS finite element thermal analysis software. By calculating, the thermal resistance of the traditional electrode structure is4.79℃/W, and the thermal resistance of new electrode structure is3.30℃/W, the thermal characteristics of the new structure are superior to the traditional structure. In addition, compared the effects on In solder and AuSn solder, diamond heat sink and copper heat sink to their thermal stress of the device, meanwhile optimized the production process of the device. After testing, the central wavelength of the new structure of the VCSEL is981.8nm, and the half width of the spectrum band is0.72nm, the threshold current of the device is0.42A. And when the injection current is1.3A, the maximum output power of the device can reach0.32W.